Category Archives: Technology: Electronics

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Introducing the BIXOLON XD5-40t Thermal Transfer Desktop Label Printers


News Image

We are proud to have completed the new XD-named desktop label printer line up through the launch of XD5-40t

BIXOLON Co., Ltd, a leading global Mobile, Label, and POS Printer manufacturer today announced the launch of the new XD5-40t thermal transfer desktop label printer, which is an addition to its mid-tier level XD5 series. Featuring a compact & robust design with optional LCD, high print quality, and outstanding performance for medium-volume printing applications.

This new 4-inch (118 mm) thermal transfer desktop label printer presenting a similar distinctive look with XD and XT series, providing fast data processing and print speeds of up to 6 ips (152 mm/sec) to produce quality labels with text, graphics, and 1D/2D barcodes. It supports an easy-to-handle 1/2-inch and 1-inch core ribbon (74 m and 300 m), simple to set up optional mono LCD, a choice of 203, 300 dpi resolutions alongside a peeler and Auto Cutter options

The XD5-40t supports media rolls with a diameter of up to 127 mm plus USB v2.0 and USB Host interfaces as standard, alongside optional Serial, 10/100 Ethernet, internal MFi certified Bluetooth v4.2 (Classic and LE) and dual-band 802.11a/b/g/n WLAN. The long-lasting the print head, cutter, and platen roller with tool-less removable design minimize operation and maintenance costs.

It is fully compatible with market-leading programming languages including SLCS, BPL-Z™, and BPL-E™. The XD5-40t supports label design software including BIXOLON’s Label Artist-II™, Label Artist™ Mobile and BarTender®. Businesses can also benefit from XPM™, a Web-Based Printer Profile Management Software offered by BIXOLON allowing users to remotely view the clear status of printers or precisely replicate printer settings.

“We are proud to have completed the new XD-named desktop label printer line up through the launch of XD5-40t,” cites John Kim Marketing Director BIXOLON Ltd. “The feature-rich XD5 series is expected to fit every single medium barcode printing application within the Manufacturing, Logistics and Retail industries due to its durable design, high performance, easy operations and maintenance backed by BIXOLON’s technical support and service”

For more information, visit http://www.BIXOLON.com, subscribe to blog.bixolon.com, or speak to your local BIXOLON sales representative.

Availability

The XD5-40t is available for order for the BIXOLON Head Office sales region. The product will then be available to order from BIXOLON Europe and BIXOLON America’s sales regions from September 2020. For more information, contact your local BIXOLON sales representative.


About BIXOLON

BIXOLON is a leading global manufacturer of innovative, advanced printing technologies, including point-of-sale receipt, label, Auto ID, and mobile printers for a wide range of environments. Millions of BIXOLON printers are used today in retail, hospitality, healthcare, banking, ticketing, post/parcel, warehousing, and other transaction-intensive industries. In 2019, for the sixth consecutive year, BIXOLON was named global mobile receipt printer market leader by Japanese research company Chunichisha.

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Sage TechBank Invests in Student Success with Columbus City Schools


Sage TechBank

Together, with the help of our community, we can make Columbus a place where every child has the tools to succeed at school and beyond.

When the coronavirus closed Columbus City Schools last March, many students lacked basic technology to continue their studies from home. “We have only been able to supply laptops to about 62% of student households and 62% of students in the district so far,” said Vandhana Veerni, CIO for the Columbus City School District. In many homes, students find themselves competing with siblings for computer time. In Columbus, 13% of households lack a suitable computer for schoolwork altogether according to the Columbus Dispatch.

Sage Sustainable Electronics is launching its TechBank to accept donations of laptops from individuals and businesses in Columbus, transforming them into low cost educational computers for Columbus City Schools students. The Sage TechBank, combined with the generosity of the Columbus community, will work to ensure that every child has a laptop of their own and can complete their education from home during the COVID-19 pandemic.    

Most businesses and many individuals have surplus laptops that they no longer need. These devices may be 4-7 years old, but they have plenty of life left for a student doing schoolwork online. “With a professional refurbisher like Sage safely and efficiently transitioning these devices between original users and our students, we unlock the massive store of idle technology in the Columbus area for the greater good of our community,” said Jill Vaské, president and cofounder of Sage.    

At no cost to the donor, donated laptops and tablets will be cleared of all data and software. Each one is then fully tested, refurbished, cleaned, relicensed with Microsoft Windows, and backed by a one-year warranty. As a Microsoft Authorized Refurbisher, Sage is authorized to install a new license of Microsoft Windows Pro on each device (or iOS for Apple) for a like-new user experience. Every device is offered for less than half the cost of similar programs. TechBank is available to every Columbus City School student.        

“Together, with the help of our community, we can make Columbus a place where every child has the tools to succeed at school and beyond,” said Vaské.

Sage TechBank Availability

To access a device, go to sagese.com/ccs-techbank and choose “CCS Student.” Fill out the simple form to gain access to a dedicated shopping site for students.

To donate a device, go to sagese.com/ccs-techbank and choose “Donor.” Fill out the simple form to receive instructions on how and where to send your working donated devices, as well as packaging options supplied by Sage.

About Sage Sustainable Electronics

Sage’s mission is to make the world more sustainable by extending the life of electronics. Sage provides IT lifecycle services to businesses large and small, helping them reduce data security risks and operational costs, and increase asset value. Through strategic asset management programs for technology donation, resale, redeployment, lease return, employee purchase, and recycling, Sage creates organization-wide benefits to businesses nationwide.

The Sage GoodTogether® Program supports corporate social responsibility (CSR) efforts by redirecting a portion of enterprise and community surplus to benefit a variety of social services and reduce digital exclusion among low income Americans. Sage TechBank is a community donations initiative under Sage’s GoodTogether program, providing essential data privacy services to donors, and community-sourced devices to people in need. For more information, call 844-4SAGESE or visit http://www.sageSE.com.

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the first maskless aligner for manufacturing in Spain


MLA300 Maskless Aligner

For sure we could not be competitive for production against big foundries, but during the scale-up of the production, the high throughput of MLA300 significantly raises the threshold level for switching to external foundries.

Heidelberg Instruments received a purchase order for a production-level maskless aligner MLA300 from KERAjet, a digital ceramic printing company from Spain.

KERAjet is an inventor and a pioneer in digital ceramic printing solutions. The company is steadily growing and actively invests in R&D to develop new technologies, not limited to ceramics.

A few years ago, KERAjet embarked on a microelectronics project. Initially, the company used services of external silicon foundries, but it soon realized that a new batch needs to be produced to test every small change in the design, which is expensive and takes a minimum of six months.

To reduce the batch production from several months to a few days, KERAjet decided to invest in their own R&D microelectronics lab equipped with a Maskless Aligner.

“For sure we could not be competitive for production against big foundries, but during the scale-up of the production, the high throughput of MLA300 significantly raises the threshold level for switching to external foundries,” says Rafael Vicent, head of the R&D department at KERAjet.

MLA300 is the first maskless aligner designed by Heidelberg Instruments specifically for low- and mid-volume manufacturing. The tool was released in 2019 and is already installed and running at a few production sites. MLA300 replaces mask aligners and steppers for applications where maskless lithography has a significant advantage: Patterning of substrates with warp or surface topography (e.g. alumina) which can be compensated during patterning, or small series, prototyping and legacy product manufacturing where the direct writing greatly simplifies and shortens the process. Any application that requires a flexible adaptation of the pattern can be efficiently implemented by the MLA300 system.

MLA300 was designed in close collaboration with industrial customers to meet their stringent requirements. It can be fully automated and compatible with manufacturing execution systems (MES). The MLA300 can integrate up to 4 exposure modules to provide sufficient throughput for industrial applications. Users can customize the system according to their requirements in resolution, writing speed, resists and substrate handling by choosing modules with different wavelength and resolution.

“MLA300 is one of our most demanding R&D projects ever. Our engineers developed an optical engine that integrates up to four optic modules. It is even possible to combine modules with different wavelengths or resolutions. That means you can customize the MLA300 according to the specific application requirements in terms of resolution, write-speed and substrate handling,” says Steffen Diez, COO of Heidelberg Instruments.

About Heidelberg Instruments:

Heidelberg Instruments has been dominating the market for direct-write laser lithography tools for over 35 years, with approximately 1,000 tools installed worldwide. The product range covers everything from versatile micro- and nanofabrication table-top tools for research to high-end lithography for semiconductor photomask production.

For more details, please contact:

Dr. Philip Paul, MLA300 Product Manager at Heidelberg Instruments

Tel: +496221-3430 0

E-mail: philip.paul@himt.de

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Ultracapacitor, Responding Mementary Blackouts for UPS


◎ High Power Low Density (Low ESR)

◎ Over 500,000 cycle life (Semi-permanent)

◎ For UPS, AGV, Regenerative Energy Applications

◎ RoHS/WEEE/REACH compliant

VINATech’s Ultracapacitors have been used in the applications of Energy, Automotive, and Industrial. VINATech’s technologies for the energy and industrial, includes numerous solutions from both the Ultracapacitors and the Fuel Cell ranges of efficient energy use.

Snap In Ultracapacitor ranges from 100 farads capacitance in a 22 mm x 45 mm (D x L) size can to 500 farads capacitance in a 35mm x 82mm (D x L) size can, and will have Mass Production in multi-site, and VINATech will serve numbers of customers with the best customer service and reasonable lead time.

Hy-Cap Ultracapacitors have higher power density, higher charge/discharge efficiency, wide operating temperature range, and longer life compared to lithium ion secondary batteries. Hy-Cap Ultracapacitor instantaneously or continuously supplies high current after storing a lot of electrical energy instantaneously by physically adsorbing and desorbing charges on the surface of activated carbon. VINATech Ultracapacitors are the environmentally friendly energy storage devices and have a high power density and long life, and Hy-Cap will be ideal to respond to momentary blackouts for Uninterruptible Power Supply (UPS) and to compensate peak power for Pitch Control of Wind Turbines.

VINATech’s mass production in the industry had launched the 3.0V Electric Double Layer Capacitor (EDLC) for the first time since 2010, with a 23% increase in energy density compared to 2.7V EDLC. VINATech’s Pulse Capacitor(VPC) launched recently with the operating voltage range of 2.5V to 3.8V. In particular, we are equipped with the world class smart-factory production technologies in the field of radial type supercapacitors 1F to 1,000F capacitance supercapacitors.

Custom Design Ultracapacitor modules at VINATech R&D

Hy-Cap, Snap In Series Ultracapacitors provides Capacitance ranges from 100 farad to 500 farad and with rated voltage at 2.7V and at 3.0V, and VINATech R&D Lab and Module Team provide custom design Ultracapacitor modules in series or in parallel.

◎ Learn more about 3v Snap In Ultracapacitor Datasheet on our web site

    https://www.vina.co.kr/eng/product/supercapacitor-3v0.php#snap3v0

◎ Learn more about 2.7v Snap In Ultracapacitor Datasheet on our web site

    https://www.vina.co.kr/eng/product/supercapacitor-2v7.php#snap2v7

VINATech’s Snap In Ultracapacitor provides over 500,000 cycle life(semi-permanent) and High Power density with Low ESR. Snap In Ultracapacitor Datasheet is available on our web site and contact us for customizing the design or detailed information about Ultracapacitors modules. Most of the companies involved in globally located supply chain as well as multi-site manufacturing firms, therefore, VINATech Vietnam factory, Jeonju R&D lab and Jeonju production line will be providing great services to our valued customers worldwide.

About VINATech

VINATech established in 1999 has developed and produced Electric Double Layer Capacitor (EDLC, e.g. Ultracapacitor or Supercapacitor) and Fuel Cell Membrane Electrode Assembly, which has been equipped with smart-factory based production facilities with the highest level of automation in order to ensure the world-class quality level. Call +82 31 448 3066 or contact us for Ultracapacitor solution and please visit our web site for more information.

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Happy Plugs® Launches New Generation of True Wireless Headphones


Happy Plugs, True Wireless Earbuds, Headphones, Earbuds, Tech, Fashion Tech, Swedish, Sweden, Wireless, Launch

The Air 1 Plus in White Marble from Happy Plugs

Happy Plugs is proud to announce the addition of the Air 1 Plus to their family of truly wireless headphones. This marks the fifth generation of true wireless headphones for the brand and an exciting upgrade to their flagship product.

Happy Plugs is proud to announce the addition of the Air 1 Plus to their family of truly wireless headphones. This marks the fifth generation of true wireless headphones for the brand and an exciting upgrade to their flagship product. The new Air 1 Plus features two style options, Earbud and In-Ear, so consumers can enjoy not just great sound quality at an affordable price, but maximum comfort and wear based on the listener’s personal fit preferences.

Designed in Sweden to bring you the latest in fashion, function, and technology; the Air 1 Plus offers a battery life of 40 hours and aptX™-codecs to ensure pure and clear wireless sound on all iOS and Android devices for the best music experience. The new generation Qualcomm® CVC 8.0 clear voice and wind noise reduction microphone technology together with the latest Bluetooth 5.1 connectivity ensures a seamless and powerful fashion tech headphone experience at an extremely competitive price point.

Fully charged, the Happy Plugs Air 1 Plus listening for 6.5 hours. The stylishly designed storage and charging case holds another 5 charges, giving up to 40 hours of playback. And if users need to charge in a hurry, a 10-minute USB-C quick charge gives up to 90 minutes of play time.

Featuring 14 different touch controls, users can easily manage their music and calls with a single touch, adjust the volume or access Siri or Google Assistant.

Created with a contemporary look that remains faithful to the Happy Plugs’ spirit of fashion tech, the Air 1 Plus blends seamlessly with your everyday style, whether it’s a street look, tailored suit, or gym gear. And with two fit options available: Earbud OR In-Ear; optimal comfort and security are ensured for any ear shape and any activity.

“With the fifth generation of truly wireless headphones we’ve given fans a more powerful experience and better sound in the same compact design. Even the battery has been boosted by more than 185% to 40 hours of playtime compared to the previous model. Happy Plugs never stop challenging the boundaries of performance and design and this obsession has led to the brand becoming a market leader in fashion tech,” says Andreas Vural, founder of Happy Plugs.

The Air 1 Plus, retailing for just USD $99.99 (EUR €99.99, CAD $129.99, GBP 89.99, SEK 999), are available on happyplugs.com and in their worldwide retail accounts, and come in five fashion forward colorways – White, Black, Gold, Pink Gold, and White Marble.

For more information, please visit http://www.happyplugs.com.

Follow the conversation at @happyplugs on Instagram, Facebook, Twitter and YouTube using #happyplugs

Product Photos:

For product photos visit: https://bit.ly/Air1Plus-Photos

For lifestyle photos visit: https://bit.ly/Air1Plus-Lifestyles 

About Happy Plugs:

Happy Plugs is a Swedish house of lifestyle brands based in Stockholm. The company is a global leader in fashion tech with a mission to transform the consumer electronics industry by merging innovative design, fashion and technology. The brand recently collaborated with fashion house Saint Laurent on headphones.

Happy Plugs is an award-winning lifestyle and fashion brand with the ambition of transforming essential tech accessories into fashion must-haves. Happy Plugs is available in the most prestigious concept, department and retail stores in over 70 countries and 10,000 retailers worldwide. Private equity fund Scope Growth III LP is, together with the company’s founder Andreas Vural, major shareholders of Happy Plugs.

Notes for Editors:

TECHNICAL SPECIFICATIONS

Bluetooth Version: 5.0

Total Playtime: 40h

Wireless Talk Time: 6.5

Standby Time: 120h

Battery for headphones: 40mAh

Battery for Charge Case: 630mAh

Full charge time: 1.5h

Driver Unit: 12mm

Support Codecs: aptX, AAC / SBC

Sensitivity: 120+/- dB (Earbud) / 106+/- dB (In-Ear)

Frequency Response: 20-20k Hz

Impedance: 16Ω

Size for Charge Case: 69 x 54 x 23 mm

Weight for Headphones: 3.75g

Weight for Charge Case: 47g

WHAT’S IN THE BOX (EARBUD)

2 x Air 1 Plus Headphones

Charge & Storage Case

2 x Silicon Sleeves

TYPE-C Charging Cable

Manual & Warranty Information

WHAT’S IN THE BOX (IN-EAR)

2 x Air 1 Plus Headphones

Charge & Storage Case

6 x Silicon Sleeves

TYPE-C Charging Cable

Manual & Warranty Information

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YES (Yield Engineering Systems, Inc.) SVP Dr. Zia Karim to Deliver ECTC Paper on Results of Joint Research with HD MicroSystems


Yield Engineering Systems

“Working jointly with YES, we were able to understand the effect of vacuum cure on our industry standard HD-4100 polyimide, HD8820 PBO and low-temperature cure HD-7110. ” said Ron Legario, Technical Service Manager for HD Microsystems.

YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for the semiconductor advanced packaging, life sciences and “more-than-Moore” markets, today announced that Zia Karim, Ph.D., the company’s Senior VP and CMO, Business Development and Strategic Marketing, will present an ECTC paper next month detailing the company’s work with HD MicroSystems to characterize the performance of three polyimide films under a range of process conditions.

“Working jointly with YES, we were able to understand the effect of vacuum cure on our industry standard HD-4100 polyimide, HD8820 PBO and low-temperature cure HD-7110. We found that vacuum cure is a viable alternative to atmospheric cure of these products and provided benefits in thermal properties and potential for enhanced productivity,” said Ron Legario, Technical Service Manager for HD Microsystems.

“Using vacuum cure, we were able to demonstrate better outgassing, thermal and electrical properties for these films compared to atmospheric methods, with better CoO to support customers’ roadmap to cost-effective heterogeneous integration and 3D stacking solutions,” said Dr. Karim. “I look forward to sharing our findings with the ECTC community during technical session 7: Advances in Packaging at the Wafer/Panel Level.” The ECTC 2020 virtual conference, of which YES is a sponsor, will be accessible free of charge from June 3 through June 30 at ectc.net.

The companies conducted their joint research using YES’s flagship product, the VertaCure vacuum curing system, which provides significant benefits for next-generation advanced packaging. Typical VertaCure applications are polyimide or PBO cure, wafer-to-wafer bonding anneal, vacuum anneal, and pre-metal or pre-PVD bake and degas.

About YES

YES (Yield Engineering Systems, Inc.) is a leading manufacturer of high-tech, cost-effective equipment for transforming surfaces, materials and interfaces. The company’s product lines include high-temperature vacuum cure ovens, chemical vapor deposition (CVD) systems, and plasma etching tools used for precise surface modification and thin-film coating of semiconductor wafers, semiconductor and MEMS devices, biosensors and medical substrates. With YES, customers ranging from startups to Fortune 100 companies can create and volume-produce products in a wide range of markets, including Advanced Packaging, MEMS, Augmented Reality/Virtual Reality and Life Sciences. YES is headquartered in the San Francisco Bay Area with offices in Livermore and Fremont, and a growing presence globally. For more information about YES, please visit http://www.yieldengineering.com

About HD Microsystems

Founded in 1997, HD MicroSystems (HDM) is a 50-50 joint venture of the Hitachi Chemical Company and DuPont. HD MicroSystems is the world’s largest supplier of polyimide and PBO precursor chemistries specifically engineered for microelectronic applications. When applied and cured, these materials transform into polyimide and PBO films with unique end use properties. HDM’s product line is broad, consisting of photosensitive coatings, standard non-photosensitive coatings, high temperature adhesives, optically clear coatings and a full line of complementary ancillary products.

About ECTC

The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society. The technical program contains papers covering leading edge developments and technical innovations across the packaging spectrum. Topics include advanced packaging, modeling and simulation, photonics, interconnections, materials and processing, applied reliability, assembly and manufacturing technology, components and RF, and emerging technologies.

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AUO Heads Space4Money in Building Smart Showcase for Taiwan’s National Palace Museum


AUO headed Space4Money to deliver Asia’s largest interactive Smart Collection Wall at Taiwan’s National Palace Museum.

AU Optronics Corp. (“AUO” or the “Company”) has leveraged its profound display technologies and teamed up with Space4Money, the Company’s wholly-owned subsidiary specializing in smart retail software and hardware integration solutions, to deliver Asia’s largest interactive Smart Collection Wall(*) and Information Wall displays, officially unveiled at the Orientation Gallery of Taiwan’s National Palace Museum. Following the successful completion of smart retail spaces for leading domestic telecommunications companies, restaurant chains, creative arts and department store brands, AUO once again leads Space4Money to wield its exceptional expertise in product technologies and smart interactive solutions to offer a brand new experience for visitors to the National Palace Museum.

“AUO and Space4Money are delighted to have joined in building a smart orientation space for the National Palace Museum. At this very center of the Chinese cultural and art heritage, we have applied cutting-edge display and smart interactive technologies to present an all-new experience for museum visitors right at the starting point of the tour,” said Andy Yang, AUO’s Vice President of Strategic Investment & New Business Operations. “In the future, Space4Money will continue to advance digital transformation by making best use of its cloud computing and software and hardware integration capabilities to introduce more innovative concepts for smart showcasing, and combining advanced display technologies and creative arts content so that audiences far and wide enjoy a personal touch to their visiting experience.”

To meet the new trends of smart showcasing and digital creative arts, Space4Money has partnered with Digimax Inc., the world’s premier animation studio, to achieve a melange of technology and humanities with its interactive smart showcase integrating the National Palace Museum’s digital archive of artifacts in the Orientation Gallery. Among the installations, the Smart Collection Wall, measuring at 12 meters in width, is currently the largest(*) of its kind in Asia. The interactive wall uses 20 pieces of AUO’s 55-inch high spec video wall displays, boasting high resolution, low reflection, and appealing extreme narrow bezel design. The bezel with displays assembled is a mere 1.8mm wide, forming an almost seamless single large screen for viewers to see a full spread of images and enjoy an immersive viewing experience. The Smart Collection Wall, inspired by the museum’s Qing dynasty “Carved Sandalwood Curio Box with 32 Items”, has an intuitive and friendly user interface and infrared sensor design to allow several users to select, drag and swipe pictures, videos, animations, 360-degree digital models, and writing interpretations of over 300 artifacts at the same time. After accessing the virtual artworks, visitors are encouraged to explore further the actual collections in the museum. On both sides of the Orientation Gallery, the Information Walls, each composed of four 55-inch video wall displays, showcase the latest museum exhibitions and events information for visitors to get a sneak preview.

As a leader of commercial and industrial displays, AUO will continue to extend from its core competence of displays as a critical interface, and through wholly-owned subsidiaries including ComQi and JohnRyan in the U.S. and Europe, which specialize in digital signage software and hardware integration solutions, and the full support of AUO’s group companies to develop business, transportation, medical, industrial and educational verticals, building smart commercial and industrial IoT ecosystems with customers and partners to seize the new business opportunities of digital transformation in each vertical with maximum synergy.


  • Based on the available market research information as of May 27, 2020.

AUO photos can be downloaded at the Company’s website:

https://auo.com/en-global/Download_Photos

Any use of photographs must cite the source thereof as AU Optronics Corporation.

ABOUT AU OPTRONICS

AU Optronics Corp. (“AUO”) is one of the world’s leading providers of optoelectronic solutions. Based on its profound R&D and manufacturing experience, AUO offers a full range of display applications and smart solutions integrating software and hardware, and leverages its core expertise to enter new business areas such as solar, smart retail, general health, circular economy and smart manufacturing service. Additionally, AUO has also been named to the Dow Jones Sustainability World Index since 2010. AUO’s consolidated net revenues in 2019 were NT$268.79 billion. For more information, please visit AUO.com.

ABOUT SPACE4MONEY

Space4Money is a subsidiary of AU Optronics with a focus on smart retail solutions. With cloud services as its core, Space4Money teams up with business partners to offer next-generation software and hardware integration services featuring online and offline, virtual and hybrid solutions for retailers, business owners and shoppers to deliver a better consumer experience.

Safe Harbour Notice

AU Optronics Corp. (“AUO” or the “Company”), a global leader of TFT-LCD panels, today announced the above news. Except for statements in respect of historical matters, the statements contained in this Release include “forward-looking statements” as defined in the Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on our management’s expectations, projections and beliefs at the time regarding matters including, among other things, future revenues and costs, financial performance, technology changes, capacity, utilization rates, yields, process and geographical diversification, future expansion plans and business strategy. Such forward looking statements are subject to a number of known and unknown risks and uncertainties that can cause actual results to differ materially from those expressed or implied by such statements, including risks related to the flat panel display industry, the TFT-LCD market, acceptance of and demand for our products, technological and development risks, competitive factors, and other risks described in the section entitled “Risk Factors” in our Annual Report on Form 20-F filed with the United States Securities and Exchange Commission on March 27, 2020. In addition, our SEC reports, including our Annual Report on Form 20-F contains other information on these and other factors that could affect our financial results and cause actual results to differ materially from any forward-looking information we may provide. We undertake no obligation to update or revise any forward-looking statements to reflect subsequent events, new information or future circumstances.

For more information, please contact:

Public Communication Dept.

Jessie Lee    Tel: +886-3-5008800 ext 3206    Email : jessie.jc.lee@auo.com

Katie Chen    Tel: +886-3-5008800 ext 3615    Email : katie.chen@auo.com

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Appareo Releases Highly-Capable Rugged LTE Telematics Gateway with 6 CAN Busses, Wi-Fi, Bluetooth, BroadR Reach, Ethernet, and GPS


Appareo Gateway 260

Appareo Gateway 260

Gateway 260 was designed to aggregate local/wired communications and Wi-Fi/cellular connectivity in one box with powerful processing capabilities, lowering the total cost for our customers.

Appareo today released a new product in the company’s award-winning line of telematically-enabled electronic control units (ECUs). The Gateway 260 is a rugged yet lightweight edge computing platform for mobile equipment applications that provides a wide range of communication technologies: Wi-Fi, Bluetooth, Cellular, GPS, BroadR-Reach, Ethernet, and controller area networking (CAN). The device is built with an IP67-rated rugged enclosure for use outdoors and for mounting on heavy machinery, and like all Appareo Gateways, the Gateway 260 is built on a popular distribution of embedded Linux (Yocto) with Docker support that allows developers to quickly deploy applications.

The Appareo Gateway 260 is unique in that it couples the capabilities of a modern LTE connectivity device and a powerful computational platform capable of receiving and processing data from a wide range of vehicle networks and buses.

“While other solutions require multiple, separate devices to accomplish computation and cloud connectivity, Gateway 260 was designed to aggregate local/wired communications and Wi-Fi/cellular connectivity in one box with powerful processing capabilities, lowering the total cost for our customers,” said David Batcheller, President & CEO of Appareo. “Our architecture that enables strong local area network integration between off-highway equipment and mobile devices like phones and tablets continues in the Gateway 260. This allows our customers to create mobile app experiences that control or monitor their machines using the operator’s portable electronic devices.”

For example, Väderstad and Appareo collaborated to design an entirely new machine control architecture for Väderstad planters and seeders, uniquely featuring the capability to control the machine using iPads through a Wi-Fi interface. The Appareo Gateway acts as the server for the user interface, contains all the control logic necessary to operate the machine, and commands other ECUs on the CAN bus to execute machine tasks or get information. The user has the ability to utilize an ISOBUS-compatible Virtual Terminal, an iPad display, or both at the same time. With the inclusion of an iPad as a control interface, the user is able to perform all functions wirelessly to the machine, which has made out-of-cab operations much more convenient. Väderstad was the first agricultural machinery manufacturer to utilize a mobile tablet in this way.

From remote diagnostics (securely accessing devices to troubleshoot equipment in real time) to inexpensively deploying firmware updates through differential software updating tools, Appareo Gateways offer a wide spectrum of capabilities.

One company that integrated Appareo’s 300 Series Gateways for its telematic solutions is AGCO Corporation. AGCO utilized an Appareo 300 Series Gateway with Iridium connectivity to expand AgCommand, AGCO’s complete, end-to-end, wireless telemetry solution for remote precision agriculture and machine monitoring. Appareo is one of only a few integrators in the world for the 9603 Iridium chipset — the smallest commercial two-way satellite transceiver — which enabled AGCO to become the first in agriculture to equip machines with connectivity on a broad, global scale. The Appareo Gateway can collect and distribute real-time data, product and performance data, health and asset management data, location data, security and recovery data, in addition to remote diagnostics and the possibility for future predictive maintenance capabilities.

To learn more about Appareo’s line of Gateways, visit http://www.appareo.com/products/highly-capable-telematic-products/.

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Vizzion Releases a Report on How On-Vehicle and Roadside Cameras Work Together to Validate Road Weather Conditions


A time-lapse of precipitation in Montreal.

Road conditions can change from damp to snowy to slush all over the course of an hour, greatly affecting traction and driver safety.

Through their roadside and on-vehicle cameras, Vizzion provides the complete picture of hazardous road conditions and how they affect drivers.

Vizzion, the world’s largest traffic camera data aggregator, has released a report outlining how camera feeds are an ideal way of detecting and validating hazardous weather-related road conditions. Some of the most potentially dangerous factors for drivers are road weather phenomena such as wet and snowy roads, precipitation, fog, and flooding, yet it remains difficult to validate such dangerous conditions with conventional technology. Vehicle data collected from smart sensors on wipers, brakes, and fog lights can be inconsistent and difficult to confirm, and weather stations, while able to provide relatively accurate atmospheric information, may be kilometers away from the roadways in question and may not reflect local road conditions.

In many cases, the best way to identify hazardous weather conditions is through camera imagery. In the report, which can be read in full on Vizzion’s website, Vizzion offers a simple, hyper-local “seeing is believing” solution through their roadside camera network and exclusive on-vehicle imagery, providing drivers, road incident editors, and automated systems with an unparalleled view of current weather conditions and allowing them access to the most up-to-date and accurate information about dangerous roadways. Through the seamless integration of their roadside cameras alongside their on-vehicle cameras, Vizzion is uniquely equipped to provide multiple perspectives of the road showing the complete picture of how drivers are impacted by fog, rain, snow, flooding, and other hazardous driving conditions.

In the report, Vizzion goes into detail as to how different types of cameras excel at validating different types of hazardous road weather. Roadside cameras, with an average view distance of around 520 meters of roadway, are highly effective in visualizing low visibility weather conditions such as fog. Paired with Vizzion’s automated visibility detection analytics, their roadside imagery has proven to be one of the most effective sources of road fog data available. A recent manual review found 97% of Vizzion’s fog detections were true positives.

Vizzion also found that on-vehicle cameras are particularly useful in observing driving conditions during rainfall. With their “driver’s-eye view,” the cameras allow viewers to judge whether the road looks safe to navigate. With the closer vantage point of the road surface through the vehicle’s windshield, Vizzion contends that on-vehicle cameras prove useful in detecting both actual rainfall and the hazardous conditions created through accumulation of water on the road surface.

The report also mentions how snowy conditions are an example of when roadside and on-vehicle cameras work in tandem to provide complementary information. Accumulated snow on the road makes the surface slippery and can be hazardous if not cleared, and falling snow can decrease visibility for drivers. Vizzion has found that on-vehicle cameras are ideal for seeing if falling snow has covered the road and how it may impact traction, while roadside cameras can provide a look into the distance and show if visibility has been affected by the winter weather.

Many of Vizzion’s findings are related to day-to-day weather events, but they also show that cameras are useful in tracking more severe natural phenomena such as floods and tropical storms. Roadside cameras provide visual evidence of flooding that can’t be found from other sources such as vehicle GPS data. They note that cameras are often the first tool through which the effects of such extreme weather are noticed.

Vizzion’s report concludes that in addition to providing an easily verifiable and simple to digest means of measuring vehicle traffic, cameras are equally effective in giving viewers a look at the weather conditions on a given stretch of road. With the flexibility to be integrated into driver-facing apps and infotainment platforms, processed via automated analysis, and used for ground truth studies against alternative road weather sources, Vizzion’s imagery and visibility data is one of the most user-friendly, versatile, and accurate datasets for road surface conditions available. For more information, read the full report on Vizzion’s website.

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Questex Postpones Sensors Expo & Conference Due to the COVID-19 Pandemic


Sensors Expo & Conference

“The health and wellness of the sensors and embedded technology community, and the community at large, is of paramount importance. The COVID-19 circumstances have made postponement unavoidable.”

Co-located events Embedded Technologies Expo & Conference, Autonomous Technologies Conference, and IoT Implementation Forum Also Included in Postponement

Questex, the parent company of Sensors Expo & Conference (#Sensors20), today announces the events were forced to postponement due to the COVID-19 circumstances. Originally scheduled to run June 22-24, 2020, the Sensors, IoT, and Embedded Week collection of events – Sensors Expo & Conference, Embedded Technologies Expo & Conference, Autonomous Technologies Conference, and IoT Implementation Forum – have all been rescheduled to November 16-18, 2020 at the McEnery Convention Center in San Jose, California.

“We recognize all the hard work that so many have put into preparing for their exhibit booths, speaker presentations and networking programs that accompany Sensors Expo & Conference,” said Paul Miller, CEO of Sensors Expo & Conference parent company, Questex. “This year is the first time in 35 years the event has been forced to postpone. The health and wellness of the sensors and embedded technology community, and the community at large, is of paramount importance. The COVID-19 circumstances have made postponement unavoidable.”

As part of Sensors, IoT, and Embedded Week – Sensors Expo & Conference along with Embedded Technologies Expo & Conference, Autonomous Technologies Conference, and IoT Implementation Forum – participants will have unprecedented access to the technical innovations and experts that are addressing real-world challenges and shaping the future within these technology areas. The events will offer exclusive access to industry giants covering the expo floor launching new and exciting technologies, invaluable networking opportunities, and a comprehensive conference program with highly practical, actionable information focused on today’s applications and future trends. Furthermore, many COVID-19 solutions will be highlighted demonstrating the importance of the Sensors Community in solving the Pandemic problems we all face. A series of virtual events will also be announced shortly to help keep the sensors and embedded technology communities connected. For the latest information, visit http://www.sensorsexpo.com.

About Sensors, IoT, and Embedded Week

Sensors, IoT, and Embedded Week is set to take over Silicon Valley with four co-located events that will take place November 16-18, 2020 at the McEnery Convention Center in San Jose, California. These events will host the premier gathering of design engineers in North America at the flagship 2020 Sensors Expo & Conference, Embedded Technologies Expo & Conference, Autonomous Vehicle Sensors Conference, and the inaugural IoT Implementation Forum. Collectively, these events will showcase the design, application, and disruption of these technologies.

About Questex

Questex helps people live better and longer. Questex brings people together in the markets that help people live better: travel, hospitality and wellness; the industries that help people live longer: life science and healthcare; and the technologies that enable and fuel these new experiences. We live in the experience economy – connecting our ecosystem through live events, surrounded by data insights and digital communities. We deliver experience and real results. It happens here.

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Media Contact

Kate Spellman

Chief Marketing Officer

Questex

kspellman@questex.com

212 895 8488

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