Technology: Computer

PICMG® Releases Its Newest COM.0 R3.1 Spec for COM Express to Include PCIe Gen 4 and USB 4.0 Support

Leave a comment


ExpressBASE6 R3.1-F


SAN JOSE, Calif. (PRWEB)

Summary:

  • COM.0 R3.1 adds support for PCIe Gen 4, for all module types, while adding USB4 support for Type 6 and updating 10G Ethernet to support CEI side-band signaling plus adding a second PCIe Clock for Type 7

  • R3.1 compliant, ADLINK provides two new modules, along with out-of-the-box ready development kits

  • Express-ADP Type 6 Basic size: powered by 12th Gen Intel® Core™ supporting advanced hybrid architecture with up to 6 Performance-cores (P-cores) and 8 Efficient-cores (E-cores) at 15W/28W/45W TDP

  • Express-ID7 Type 7 Basic size: powered by Intel® Xeon® D-1700 featuring integrated high-speed Ethernet for up to 4x 10G combined with 16 PCIe Gen4 lanes for instantaneous responsiveness and performance

ADLINK Technology Inc., a global leader in edge computing and a chair of the PICMG® subcommittee, is pleased to demonstrate PICMG’s latest COM.0 R3.1 with two new COM Express modules complying to the revision — ADLINK’s Express ADP Type 6 Basic size and Express-ID7 Type 7 Basic size.

Compared to R3.0, Revision 3.1 has added support for several advanced interfaces suitable for next-gen AIoT applications, such as PCIe Gen 4 support across all module types, USB4 for Type 6 and adding a second PCIe Clock while updating 10G Ethernet to support CEI side-band signaling for Type 7. Other enhancements include adding options for general purpose SPI, MIPI-CSI connectors, and SoundWire, as well as adding IPMB for Type 7.

R3.1 compliant, ADLINK’s Express-ADP Type 6 Basic size and Express-ID7 Type 7 Basic size modules are respectively powered by 12th Gen Intel® Core™ and Intel® Xeon® D-1700 processors.

ADLINK Express-ADP Type 6 Basic size utilizes 12th Gen Intel® Core™ processors based on advanced hybrid architecture with up to 6 Performance-cores (P-cores) and 8 Efficient-cores (E-cores), effectively boosting productivity and fueling IoT innovation across a wide variety of deployments. It provides DDR5 memory support with up to 4800 MT/s combined with increased cache, and integrated Intel® Iris® Xe graphics with up to 96EUs, to offer four concurrent 4K60 HDR displays and Intel® Deep Learning Boost for superior AI performance. Using DDI, eDP 1.4b and USB4/TBT4, the four independent displays support Display Alternative mode, the module provides premium graphics features for superior content support, display and I/O virtualization.

ADLINK Express-ID7 Type 7 Basic size, based on Intel® Xeon® D-1700 processor, features integrated high-speed Ethernet for up to 4x 10G combined with 16 PCIe Gen4 lanes for instantaneous responsiveness and performance. Built for rugged and edge AI applications, this ADLINK COM with Intel® Ice Lake-D empowers system integrators to realize all of their IoT innovations, from edge networking, unmanned aerial vehicles, autonomous driving, robotic surgery, to rugged HPC servers, 5G base stations, automatic drilling, ship management, and more.

For immediate application-specific development, ADLINK will also have out-of-the-box-ready development kits with the abovementioned COM.0 R3.1 modules. Developers can seek further details about these dev kits from ADLINK’s I-Pi wiki website. In addition, for convenient reference testing, ADLINK offers carrier boards — Express-BASE6 R3.1 and Express-BASE 7 R3.1 — and bundled starter kits, available on ADLINK’s website.

Visit ADLINK Technology to learn more about these COM.0 R3.1 modules.

About ADLINK Technology

ADLINK Technology Inc. (TAIEX:6166) leads edge computing, the catalyst for a world powered by artificial intelligence. ADLINK manufactures edge hardware and develops edge software for embedded, distributed, and intelligent computing – from powering medical PCs in the intensive care unit to building the world’s first high-speed autonomous race car – more than 1600 customers around the world trust ADLINK for mission-critical success. ADLINK holds top-tier edge partnerships with Intel, NVIDIA, AWS, and SAS, and also participates on the Intel Board of Advisors, ROS 2 Technical Steering Committee and Autoware Foundation Board. ADLINK contributes to open source, robotics, autonomous, IoT and 5G standards initiatives across 24+ consortiums, driving innovation in manufacturing, telecommunications, healthcare, energy, defense, transportation and infotainment. For over 25 years, with 1800+ ADLINKers and 200+ partners, ADLINK enables the technologies of today and tomorrow, advancing technology and society around the world. Follow ADLINK Technology on LinkedIn, Twitter, Facebook or visit adlinktech.com.

Share article on social media or email:

Leave a Reply