Fabricated to specification as thin as 0.018” with 1.2 micron uniform thickness, 10 arc-sec. parallelism, and can be custom perforated.

Ideal for GaAs, silicon, and other semiconductor devices, they can be perforated with customer specified hole patterns to fit vacuum hold-down or delamination fixtures and help assure consistent part-to-part uniformity.

PROVIDENCE, R.I. (PRWEB)
August 12, 2020

Meller Optics, Inc. has introduced a custom fabricated semiconductor wafer carriers made from sapphire with different hole patterns to match vacuum hold-down or delamination fixtures.

Meller Sapphire Wafer Carriers can be fabricated to specification as thin as 0.018” with 1.2 micron uniform thickness, 10 arc-sec. parallelism, and can be custom perforated because of their superior mechanical strength. Featuring Mohs 9 hardness, which is second only to diamond, these carriers are impervious to solvents and etchants and are chip-resistant; making them superior to quartz and other materials for semiconductor thinning.

Ideal for GaAs, silicon, and other semiconductor devices, they can be perforated with customer specified hole patterns to fit vacuum hold-down or delamination fixtures and help assure consistent part-to-part uniformity. Highly durable and designed for repeated use, they are available in 2” to 6” dia. sizes and can be supplied with reference flats and laser markings.

Meller Sapphire Wafer Carriers are priced according to configuration, size, and quantity. Price quotations are available upon request.

For more information contact:

Meller Optics, Inc.

Steve Lydon, Marketing

120 Corliss St. / P.O. Box 6001

Providence, RI 02940

(800)     821-0180 FAX (401) 331-0519

e-mail: steve@melleroptics.com

http://www.melleroptics.com

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