Technology: Electronics

Heilind Electronics Introduces Amphenol ICC’s FCI Basics BergStak 0.8 mm Shielded Board-to-Board Connectors

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Amphenol ICC/FCI BergStak connectors

BergStak connectors offer a shielded, high-speed and high-density solution for board-to-board applications.


WILMINGTON, Mass. (PRWEB)

Heilind Electronics, a premier distributor of electronic components worldwide and an authorized distributor for Amphenol ICC, is now stocking the manufacturer’s new FCI Basics BergStak shielded connector line. These self-aligning connectors feature a 0.8 mm double-row contact pitch, conserving printed circuit board space.

One of the key advantages of the new line is its superior EMI/EMC shielding. The connectors offer significantly reduced coupling inductance, resulting in improved electromagnetic compatibility.

BergStak connectors also feature high signal quality and fast data transmission. Designed to support applications ranging from 2.5 Gb/s to 10 Gb/s, the products meet PCIe Gen 1-3 and 10G Base KR specifications.

The connectors are available in 64 positions, with 40-140 contact options and 9 mm-20 mm stacking heights. This solution is ideal for high-speed, parallel board-to-board applications in medical electronics, industrial and manufacturing equipment, datacom and telecommunications.

Visit Heilind’s website for more information about BergStak 0.8mm shielded board-to-board connectors.

About Heilind Electronics

Heilind Electronics, Inc. (http://www.heilind.com) is one of the world’s leading distributors of connectors, relays, sensors, switches, thermal management and circuit protection products, terminal blocks, wire and cable, wiring accessories and insulation and identification products. Founded in 1974, Heilind has locations throughout the U.S., Canada, Mexico, Brazil, Germany, Singapore, Hong Kong and China. Follow Heilind on Facebook at facebook.com/Heilind and on Twitter at twitter.com/Heilind.

About Amphenol ICC

Amphenol ICC designs and produces a wide range of innovative connectors and cable assemblies for the data storage and communications, networking, telecommunications, industrial, instrumentation and automotive sectors.

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